MIPI Alliance initiates development targeted for automated driving systems
The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, initiated development of a physical layer (up to 15m) specification targeted for automated driving systems (ADS), advanced driver-assistance systems (ADAS), and other surround sensor applications. With development of the MIPI A-PHY physical layer specification already underway to meet 12-24 gigabits per second (Gbps), requirements gathering has begun to support higher speeds including over 48 Gbps for in-vehicle infotainment displays and other peripherals. When complete, the organization believes that these specifications will serve a broad spectrum of the industry’s connectivity needs.
Companies participating in the MIPI Automotive Working Group include Analog Devices, Inc., Analogix Semiconductor, Inc., BitifEye Digital Test Solutions GmbH, Cadence Design Systems, Inc., Fraunhofer IIS, Intel Corporation, Keysight Technologies Inc., L&T Technology Services, MediaTek Inc., Microchip Technology Inc., Mixel, Inc., Mobileye, an Intel Company, NXP Semiconductors, OmniVision Technologies, Inc., ON Semiconductor, Parade Technologies Ltd., Prodigy Technovations Pvt. Ltd., Qualcomm Incorporated, Robert Bosch GmbH, Samsung Electronics Co., Ltd., Socionext Inc., Sony Corporation, STMicroelectronics, Synopsys, Inc., Tektronix, Inc., Teledyne LeCroy, Toshiba Corporation, University of New Hampshire InterOperability Lab, Valens Semiconductors, and others.
“Automakers around the globe are amid a tremendous wave of innovation related to autonomous driving, ADAS, new fuel-economy standards, vehicle electrification and connectivity, new business models, new forms of in-car infotainment, and more,” said Ian Riches, Executive Director - Global Automotive Practice with Strategy Analytics. He went on to note that the large number of applications to be supported for vehicles has placed pressure on the auto industry to integrate the various high-speed components from a large supply base in a way that is simple, efficient, and cost effective.
MIPI A-PHY v1.0 is expected to be available to developers in late 2019. The specification will reportedly optimize wiring, cost, and weight requirements, as high-speed data, control data, and optional power share the same physical wiring. The asymmetric nature of the MIPI A-PHY link, its point-to-point topology, and its reuse of generations of mobile protocols promise overall lower complexity, power consumption, and system costs for developers and automotive OEMs. It is anticipated that the first vehicles using A-PHY components will be in production in 2024.
In addition to automotive uses, the configuration of the specification will be well suited for applications such as IoT and industrial.