The tremendous confluence of new-mobility technology—related to advanced driver assistance, autonomy, connectivity, infotainment, electrification, and new business models—has placed huge pressure on the auto industry to integrate the various electronic components from a growing supply base in a way that is simple, efficient, and cost effective.
In August, the MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced that it had initiated development of a physical layer specification targeted for automated driving systems, advanced driver-assistance systems, and other surround sensor applications. The specification will reportedly optimize wiring, cost, and weight requirements as high-speed data, control data, and optional power share the same physical wiring.
With development of the MIPI A-PHY physical layer specification already underway to meet 12-24 gigabits per second (Gbps), requirements gathering has begun to support higher speeds, including over 48 Gbps for in-vehicle infotainment displays and other peripherals. When complete, the organization believes that these specifications will serve a broad spectrum of the industry’s connectivity needs.
MIPI A-PHY v1.0 is expected to be available to developers in late 2019. The asymmetric nature of the MIPI A-PHY link, its point-to-point topology, and its reuse of generations of mobile protocols promise overall lower complexity, power consumption, and system costs for developers and automotive OEMs. It is anticipated that the first vehicles using A-PHY components will be in production in 2024.
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