Qualcomm presents multi-tiered third-generation Snapdragon automotive cockpit platforms
Qualcomm Technologies, Inc. introduced its third-generation Qualcomm Snapdragon automotive cockpit platforms, with a new tiering system comprised of Performance, Premiere, and Paramount classes for the entry level, mid-tier, and super computing platforms, respectively. Qualcomm is offering the new, fully scalable third-generation Snapdragon automotive cockpit platforms with a modular architecture to allow automakers to deliver a variety of customizable options. The automotive cockpit platforms are designed to transform in-vehicle experiences by supporting higher levels of computing and intelligence needed for advanced capabilities featured in next-generation vehicles, including highly intuitive AI experiences for in-car virtual assistance, natural interactions between the vehicle and driver, and contextual safety use cases. The platform uses precise positioning for enhanced navigation solutions and cutting-edge technologies for immersive audio and rich visual experiences.
Building on the technology introduced with the Qualcomm Snapdragon 820A platform, the third-generation Snapdragon automotive platforms are engineered with immersive graphics, multimedia, computer vision, and artificial intelligence capabilities. The new platforms feature integrated heterogenous computing capabilities, leveraging the multi-core Qualcomm AI engine, Qualcomm Spectra image signal processor (ISP), fourth-generation Qualcomm Kryo central processing unit (CPU), Qualcomm Hexagon processor, and sixth-generation Qualcomm Adreno visual subsystem. The Qualcomm AI engine optimizes the AI capabilities of all primary Snapdragon cores including CPU, GPU, and Hexagon processor. The new Hexagon processor includes Hexagon vector extensions (HVX) and purposely designed optimized Hexagon tensor accelerator (HTA) to provide exceptional AI acceleration for a more power-efficient implementation of edge-based machine learning use-cases such as natural language processing and object classification. The third-generation Snapdragon automotive cockpit platforms also feature the Qualcomm secure processing unit (SPU), engineered to help protect personal and vehicle data, and Qualcomm vision-enhanced, precise positioning-based camera sensors and computer vision capabilities to support differentiated use cases on lane-level crowdsourcing of drive data for building map layers.
These platforms include virtualization support compatibility with hypervisor solutions to address the domain convergence of infotainment and instrumentation systems. These new platforms also leverage the same software architecture and framework across all tiers. The new platforms also offer comprehensive software support for Android, LINUX high-level, and other real-time operating systems.
The platforms feature an advanced suite of wireless technologies to support multi-mode cellular connectivity, Wi-Fi 6, as well as enhanced Bluetooth technologies.
Samples of the third-generation Snapdragon automotive cockpit platforms are available now. Demonstrations based on the new platforms, as well as other automotive industry leaders, are scheduled at the Qualcomm Technologies’ Automotive booth, located in the North Hall, booth 5609, during the Consumer Electronic Show (CES) 2019.