Rogers Corp. announced the latest addition to its RO3000 Series polytetrafluoroethylene (PTFE) circuit materials: RO3003G2 high-frequency laminates. RO3003G2 laminates build on the RO3003 platform to provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation. 

The combination of optimized resin and filler content along with the introduction of very low profile (VLP) electrodeposited (ED) copper translates to Dk of 3.00 @ 10 GHz (clamped stripline method) and 3.07 @ 77 GHz (microstrip differential phase length method). Company representatives say that RO3003G2 laminates also show very low insertion loss of 1.3 dB/in for 5 mil laminates, as measured by the microstrip differential phase length method. 

RO3003G2 laminates are designed to reduce insertion loss via a very low profile electrodeposited (VLP ED) copper. In addition, they reduce dielectric constant variation through PCB processing as a result of a homogeneous construction and incorporating VLP ED foil. The laminates enable designs with denser/smaller diameter micro vias, achieved by an advanced filler system using small rounded particles.

The RO3003G2 high frequency PTFE laminates are available in standard panel sizes of 24 × 18 in (610 × 457 mm), and 24 × 21 in (610 × 533.75 mm) with 0.5 oz (18 µm) or 1.0 oz (35 µm) ED Cu foil and Rolled Cu foil. They come in dielectric thicknesses of 0.005 and 0.010 in.