Advantest introduces new SoC test equipment
Advantest has expanded the range of its T2000 platform with the launch of two new modules and a test head designed for high-volume testing of devices used in automotive applications. The new equipment is designed to enhance test coverage, enable higher parallelism, and reduce the cost of test for system-on-chip (SoC) devices used in automobiles.
The new RND520 test head has 52 slots, providing the highest pin count available with Advantest’s direct-dock testing option. As a member of the HIFIX (high-fidelity tester access fixture) product line, the new test head supports massively parallel wafer-sort testing. It covers an area 40% larger than its predecessor while using center-clamp technology to ensure stable contact during wafer sorting. In addition, the test head can operate over an extended temperature range up to 175°C.
The enhanced 2GDME digital module leverages 256 channels to test a wide range of SoC devices used in automotive electronics including MCUs, APUs, ASICs and FPGAs operating at speeds up to 2 Gbps. It features a dedicated high-performance parametric measurement unit (HPMU) for every 32 I/O channels, giving the unit an expanded current capacity of up to 60 mA for every I/O channel. The module also supports high-voltage applications by enabling electrical stress testing and arbitrary waveform generator and digitizer functions.
The new 96-channel DPS192A device power supply facilitates highly parallel testing of automotive SoCs with high pin counts. This module has a voltage range of -2.0 V to +9.0 V and a current range up to 3 A. The unit’s capabilities include enhanced slew-rate control as well as a trace function to evaluate power integrity, an averaging function that improves sampling rates for measuring supply currents, and a continuous sampling function that enables a new test methodology for IDD spectrum measurement.
Visit www.advantest.com/products/ic-test-systems/t2000 for more information.