Uhnder and dSPACE establish cooperation for radar technology development
Uhnder and dSPACE have agreed to cooperate to "ensure that the developments in radar sensor technology can keep pace with the high safety requirements in traffic." Both companies will support each other in the continuous development of sensors and validation solutions.
To meet high requirements for safety and quality, radar sensors must detect their surroundings reliably and in great detail. For road use, it is important to implement measures that minimize interference and disturbance signals. To do this, Uhnder has developed a unique digital Radar-on-Chip (RoC) using a combination of advanced CMOS and Digital Code Modulation (DCM) technology. Its 4D, digitally modulated radar chip integrates 192 virtual channels onto a single chip. The company also says that it pioneers High Contrast Resolution (HCR), which provides improved range and angular resolution, and makes it possible to separate small radar reflectors from proximate large reflectors.
Throughout the development process, Uhnder says that it relies on dSPACE Automotive Radar Target Simulators to subject sensors, whose signals are processed using this modulation method, to the most realistic tests possible until the sensors are approved for series production.
“Digitally modulated radar signals offer significant advantages in ADAS and AD applications,” said Ralf Reuter, Senior Director of Customer and Application Engineering at Uhnder, about the initial results of the collaboration. “The radar test solutions from dSPACE made it easy for us to investigate interferences between radar systems and to advance our systems as realistically as possible.”
“The cooperation with Uhnder provides us with new requirements in sensor development directly and timely,” said Andreas Himmler, Senior Product Manager, dSPACE. “This gives us a head start in the development of suitable concepts for particularly reliable validation. This applies particularly to the fulfillment of our customers' challenging requirements with regard to radar target simulation.”
The companies plan to present results of their partnership with demos at trade fairs this year. The first joint showcase is currently expected to take place at the “International Conference on Microwave Intelligent Mobility 2020” in Linz (planned for July 2020) and at the “European Microwave Week 2020” in Utrecht (Sept. 13-18, 2020).