COMSOL introduced the latest release of the COMSOL Multiphysics and COMSOL Server products. Version 5.3a is designed to provide simulation specialists with cutting-edge modeling tools and increased solver performance. The company says the solution offers shape memory alloy (SMA) material models, a method for capacitively coupled plasma (CCP) simulations, and a hybrid boundary element-finite element (BEM-FEM) method for acoustics and acoustic-structure interaction.
“Our customers strive for a highly efficient product development cycle. With the multiphysics modeling capabilities of our software, they can create innovative products faster and at a lower cost than ever before. This exciting release is a result of a big focus on quality and major advances in new powerful modeling methods, increased speed, and user-driven enhancements,” said Svante Littmarck, President and CEO, COMSOL, Inc.
COMSOL 5.3a offers acoustics analysis based on the boundary element method. A framework for model reduction is available with the release of two methods, modal analysis and asymptotic waveform evaluation (AWE), for reduction of the computational complexity of mathematical models. Customers using LiveLink for MATLAB can get access to reduced models through a dedicated state-space export function. The company says that many customers, especially those involved with computational fluid dynamics (CFD) analysis, will experience up to 40% improved performance for algebraic multigrid (AMG) and 20% for geometric multigrid (GMG) solvers. Support for 3Dconnexion SpaceMouse devices is intended to make model navigation easier. The color table Cividis, optimized for people with color vision deficiency, is now available for visualization of field quantities.
Chemical engineers will reportedly benefit from the built-in library for thermodynamics properties, which features models for gases, liquids, and phase equilibria (gas-liquids). A new realizable k-e turbulence model aims to provide a more accurate description of fluid flow features. A predefined multiphysics coupling enables the modeling of heat and moisture transport in building materials and moist air.
A new method for modeling capacitively coupled plasmas (CCP), based on a non-linear time-periodic formulation, is intended to reduce solution times of CCP simulations from weeks to hours. Those working in electromagnetics can reportedly use the boundary element method to accurately analyze magnetic fields in models with large volume-to-surface ratio, including infinite domains.
Engineers designing smart metal devices, from biomedical to consumer products, can now include a shape memory alloy (SMA) material in their simulations. A SMA material can be coupled to other physics such as heat transfer. Users can also use a solid-beam connection feature as well as a new technique to model thread forces for bolts using a dedicated type of contact pair boundary condition.
The company says that apps with very large plots or many graphics windows will see improved rendering performances resulting in a more responsive user interface. COMSOL Server users will now have the option to login without a password within their corporate network.
COMSOL Multiphysics and COMSOL Server software products are supported on Windows operating system, Linux operating system, and macOS operating system. The Application Builder is supported in the Windows operating system.
To browse version 5.3a release highlights, visit www.comsol.com/release/5.3a.
To download the latest version, visit www.comsol.com/product-download.